Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions
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The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet). | The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet). | ||
It consists of two solutions: RCA1 and RCA2 plus diluted HF. | It consists of two solutions: RCA1 and RCA2 plus diluted HF. A crucial part of the RCA clean is the oxidation by H<math>_2</math>O<math>_2</math>. Therefore the life time of the RCA solutions are limited by the presence of the H<math>_2</math>O<math>_2</math> which is highly volatile at 70 <math>^o</math>C. | ||
The RCA1 contains: H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of light organics, particles and metal. <br \> | The RCA1 contains: H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of light organics, particles and metal. <br \> | ||
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*Optional: HF: 30 sec (avoid it if you have oxide as the top layer) | *Optional: HF: 30 sec (avoid it if you have oxide as the top layer) | ||
*DI water rinsing (dumping three times) | *DI water rinsing (dumping three times) | ||
For procedure details please look in the user manual positioned in LabManager. | |||
===Overview of RCA process data=== | ===Overview of RCA process data=== | ||