Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions
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It is used for removal of light organics, particles and metal. | It is used for removal of light organics, particles and metal. | ||
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It is used for removal of | It is used for removal of heavy metals, alkalies and metal hydroxides. | ||
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It is used for removal of oxide generated in RCA1 and RCA2 | It is used for removal of oxide generated in RCA1 and RCA2 | ||