Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions

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 |style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed
 |style="background:WhiteSmoke; color:black"|
-*Silicon wafers (new from the box or RCA cleaned)
+Silicon wafers with alluminium.
-**with layers of silicon oxide or silicon (oxy)nitride (RCA cleaned)
+Wafers are allowed after alluminium lift off or after alluminium etch and resiststrip in acetone
-*Quartz wafers (RCA cleaned)
-*Wafers with aluminium.
 |-
 |}