Specific Process Knowledge/Back-end processing/Laser Micromachining Tool/Lasers sources: Difference between revisions
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== Laser sources == | == Laser sources == | ||
The laser micromachining tool is equipped with two laser sources (1) picosecond laser (TBW) and (2) a nanosecond laser (IPG). The technical specification provided by the supplier 3D micromac are shown below. Refer to the Performances to know the measured values. | The laser micromachining tool is equipped with two laser sources (1) picosecond laser (TBW) and (2) a nanosecond laser (IPG). The technical specification provided by the supplier 3D micromac are shown below. Refer to the | [[/http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Laser_Micromachining_Tool|Performances]] to know the measured values. | ||
=== Specifications from 3D micromac === | === Specifications from 3D micromac === | ||
Revision as of 14:17, 27 January 2016
Laser sources
The laser micromachining tool is equipped with two laser sources (1) picosecond laser (TBW) and (2) a nanosecond laser (IPG). The technical specification provided by the supplier 3D micromac are shown below. Refer to the | Performances to know the measured values.
Specifications from 3D micromac
| Picosecond (TBW) | Nanosecond (IPG) | |
| Wavelength | 1064nm, 532nm, 355nm | 1064nm |
| Pulse duration | 10ps | 120ns |
| Repetition rate | 200 kHz up to 8000 kHz software controlled | 200kHz |
| Output power | > 50 W @ 1064 nm | 100 W |
| Warm-up time | 25min | none |
