Specific Process Knowledge/Etch/DryEtchProcessing: Difference between revisions
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| style="background:#DCDCDC;"| Comparison of the different hardware setups | | style="background:#DCDCDC;"| Comparison of the different hardware setups | ||
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| style="background: LightGray"| [[/Bonding| | | style="background: LightGray"| [[/Bonding| Using carrier wafer]] | ||
| style="background: #DCDCDC"| Processing different sizes of substrates by bonding | | style="background: #DCDCDC"| Processing different sizes of substrates by using a carriers: bonding or not bonding | ||
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| style="background: LightGray"| [[/OES| Optical Endpoint System]] | | style="background: LightGray"| [[/OES| Optical Endpoint System]] | ||
Revision as of 13:38, 22 January 2016
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Techniques, hardware and challenges common to all dry etch tools
This page contains information that is common to dry etch instruments.
| Dry etch page | Description |
|---|---|
| Hardware comparison | Comparison of the different hardware setups |
| Using carrier wafer | Processing different sizes of substrates by using a carriers: bonding or not bonding |
| Optical Endpoint System | Using the OES technique to find endpoints and to diagnose plasmas |