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Specific Process Knowledge/Etch/DryEtchProcessing/Bonding: Difference between revisions

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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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==Making Carrier with capton(polyimide) tape==
== Carriers for dry etching: Temporary bonding of samples or carriers for none bonded samples ==
[[:file:Making carrier with capton tape.docx]]
 
== Temporary bonding of wafers or chips for dry etching ==


=== Purpose ===
=== Purpose ===
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=== Procedures ===
=== Procedures ===
====Making Carrier with capton(polyimide) tape====
[[:file:Making carrier with capton tape.docx]]


==== Bonding ====
==== Bonding ====
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