Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions

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 | [[File:Chip example.png|150px]]
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-| Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer. Positions of global marks are entered in jdf file using wafer coordinate system. || Example of chip with 4 chip marks. Always position the chip marks outside the chip pattern. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0).
+| Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark is '''not''' recommended || Fabricate 2 or 3 P and Q marks. Place the P marks on the left side of the wafer and Q marks to the right. Do not place the marks closer than 15 mm to the edges of the wafer.|| Example of chip with 4 chip marks. Always position the chip marks outside the chip pattern. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0).
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