Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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@@ Line 9: / Line 9: @@
 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
+|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]</b>
 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]</b>
-|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual All Resists]]</b>
 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual Standard Resists]]</b>
@@ Line 19: / Line 19: @@
 !style="background:silver; width:100px; color:black;" align="center"|Purpose
 |style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+*In-line substrate HMDS priming
+*Coating and baking of
+**AZ MiR 701 (29cps) resist
+**AZ nLOF 2020 resist
+*Post-exposure baking at 110°C
 |style="background:WhiteSmoke; color:black"|
 *Coating and baking of
@@ Line 31: / Line 37: @@
 **AZ MiR resist
 **AZ nLOF resist
-|style="background:WhiteSmoke; color:black"|
-*In-line substrate HMDS priming
-*Coating and baking of
-**AZ MiR 701 (29cps) resist
-**AZ nLOF 2020 resist
-*Post-exposure baking at 110°C
 |style="background:WhiteSmoke; color:black"|
 *Coating of all resists
@@ Line 67: / Line 67: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
 |style="background:LightGrey; color:black"|Substrate handling
+|style="background:WhiteSmoke; color:black"|
+* Cassette-to-cassette
 |style="background:WhiteSmoke; color:black"|
 * Cassette-to-cassette
@@ Line 73: / Line 75: @@
 * Single substrate
 * Non-vacuum chuck for fragile substrates
-|style="background:WhiteSmoke; color:black"|
-* Cassette-to-cassette
 |style="background:WhiteSmoke; color:black"|
 * Single substrate
@@ Line 83: / Line 83: @@
 |-
 |style="background:LightGrey; color:black"|Permanent media
+|style="background:WhiteSmoke; color:black"|
+* AZ MiR 701 (29cps) resist
+* AZ nLOF 2020 resist
+* PGMEA for backside rinse and edge-bead removal
+* PGMEA for spinner bowl cleaning and vapor tip bath
 |style="background:WhiteSmoke; color:black"|
 * AZ5214E resist
@@ Line 90: / Line 95: @@
 |style="background:WhiteSmoke; color:black"|
 * No permanent media
-|style="background:WhiteSmoke; color:black"|
-* AZ MiR 701 (29cps) resist
-* AZ nLOF 2020 resist
-* PGMEA for backside rinse and edge-bead removal
-* PGMEA for spinner bowl cleaning and vapor tip bath
 |colspan="3" rowspan="2" align="center" style="background:WhiteSmoke; color:black"|Only manual dispense
 |style="background:WhiteSmoke; color:black"|
@@ Line 101: / Line 101: @@
 |-
 |style="background:LightGrey; color:black"|Manual dispense option
+|style="background:WhiteSmoke; color:black"|
+* no
 |style="background:WhiteSmoke; color:black"|
 * 2 automatic syringes
@@ Line 106: / Line 108: @@
 * yes
 * pneumatic dispense for SU-8 resist
-|style="background:WhiteSmoke; color:black"|
-* no
 |style="background:WhiteSmoke; color:black"|
 * Two syringe pumps
@@ Line 114: / Line 114: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
 |style="background:LightGrey; color:black"|Spindle speed
+|style="background:WhiteSmoke; color:black"|
+*10 - 9990 rpm
 |style="background:WhiteSmoke; color:black"|
 *100 - 5000 rpm
 |style="background:WhiteSmoke; color:black"|
 *10 - 5000 rpm (3000 rpm with non-vacuum chuck)
-|style="background:WhiteSmoke; color:black"|
-*10 - 9990 rpm
 |style="background:WhiteSmoke; color:black"|
 *100 - 5000 rpm
@@ Line 129: / Line 129: @@
 |-
 |style="background:LightGrey; color:black"|Gyrset
+|style="background:WhiteSmoke; color:black"|
+*no
 |style="background:WhiteSmoke; color:black"|
 *optional
 |style="background:WhiteSmoke; color:black"|
 *optional (max. speed 3000 rpm)
-|style="background:WhiteSmoke; color:black"|
-*no
 |style="background:WhiteSmoke; color:black"|
 *no
@@ Line 145: / Line 145: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Substrate  size
+|style="background:WhiteSmoke; color:black"|
+*100 mm wafers
+*150 mm wafers (tool change required)
 |style="background:WhiteSmoke; color:black"|
 *50 mm wafers
@@ Line 152: / Line 155: @@
 *100 mm wafer
 *150 mm wafer
-|style="background:WhiteSmoke; color:black"|
-*100 mm wafers
-*150 mm wafers (tool change required)
 |style="background:WhiteSmoke; color:black"|
 *50 mm wafers
@@ Line 175: / Line 175: @@
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*1-24
+*1 - 25
+|style="background:WhiteSmoke; color:black"|
+*1 - 24
 |style="background:WhiteSmoke; color:black"|
 *1
-|style="background:WhiteSmoke; color:black"|
-*1-25
 |style="background:WhiteSmoke; color:black"|
 *1
@@ Line 190: / Line 190: @@
 |-
 | style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black"|
+*Silicon
+*Glass
 |style="background:WhiteSmoke; color:black"|
 *All cleanroom materials except III-V materials
 |style="background:WhiteSmoke; color:black"|
 *All cleanroom materials except III-V materials
-|style="background:WhiteSmoke; color:black"|
-*Silicon
-*Glass
 |style="background:WhiteSmoke; color:black"|
 *III-V materials