Specific Process Knowledge/Pattern Design: Difference between revisions
No edit summary |
|||
| Line 30: | Line 30: | ||
* For '''E-beam lithography''' the layout file has to be saved as a GDS file that can be uploaded to the equipment computer. | * For '''E-beam lithography''' the layout file has to be saved as a GDS file that can be uploaded to the equipment computer. | ||
* For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. For more details see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]]. | * For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. For more details concerning pattern design for the laser see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]]. | ||
* For '''UV-lithography''' it is necescary to have a physical masks produced based on the layout file. The file format has to be CIF or GDS. | * For '''UV-lithography''' it is necescary to have a physical masks produced based on the layout file. The file format has to be CIF or GDS. | ||