Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

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	For Si(100), the relation between the width of the bottom of the etched groove (W<sub>b</sub>) and the width of the opening (W<sub>o</sub>) at the wafer surface is given by:		For Si(100), the relation between the width of the bottom of the etched groove (W<sub>b</sub>) and the width of the opening (W<sub>o</sub>) at the wafer surface in a groove etched to the depth l is given by:

			W<sub>b</sub> = W