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| <br clear="all" /> | | <br clear="all" /> |
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| ==KS Spinner==
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| [[Image:KSspinner.JPG|300x300px|right|thumb|The KS spinner is placed in C-1]]
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| In April 2015, the KS Spinner was decommissioned and replaced by '''[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]'''
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| '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#KS_Spinner click here]'''
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| ''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
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| At Danchip we have RC8-THP system which is one of the SUSS MicroTech spinners.
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| The main purpose of this equipment is experimental spinning the different resist.The spinner has one resist line, AZ5214E, for automatic dispense. All other resist dispenses manually from syringe or disposable pipettes. All SU8 spinning are done on this machine.
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| The machine can be also used for spinning on the "difficult" surfaces like the substrates with holes, backside structures and unusual shapes.
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| '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=43 LabManager]'''
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| === Equipment performance and process related parameters ===
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| {| border="2" cellspacing="0" cellpadding="2"
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black"|
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| *Spin coating and soft baking UV sensative resists
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| *Spin coating SU8 resists
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Resist
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * AZ5214E permanent line
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| * AZ4562 manual dispense
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| * SU8 resists manual dispense
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
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| |style="background:LightGrey; color:black"|Coating thickness
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * AZ5214E 1-4,2 µm
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| * AZ4526 6,2-10 µm
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| * SU8 resits 0,1-100 µm
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
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| |style="background:LightGrey; color:black"|Spin speed
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 100 - 5000 rpm
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| |-
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| |style="background:LightGrey; color:black"|Spin acceleration
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 100 - 5000 rpm/s
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| |-
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| |style="background:LightGrey; color:black"|Hotplate temperature
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * changeable temperature from 20° to 200°
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| * SU8 must be bake out on SU8 dedicated hotplates
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| * 50 mm wafers
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| * 100 mm wafers
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| * 150 mm wafers
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| |-
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| All cleanroom materials except III-V materials
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| |-
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| |style="background:LightGrey; color:black"|Batch
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 1
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| |-
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| |}
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| <br clear="all" />
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| == Manual Spin Coaters == | | == Manual Spin Coaters == |
