Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

@@ Line 69: / Line 69: @@
 |style="background:LightGrey; color:black"|Seed metal
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-Most commonly 100 nm of NiV
+Most commonly ~85 nm of NiV
 |-
 | style="background:LightGrey; color:black"|Allowed materials
@@ Line 98: / Line 98: @@
 |style="background:LightGrey; color:black"|Uniformity
 |style="background:WhiteSmoke; color:black"|
-Around 10% (depending on sample and process)
+Around 5-10% (depending on sample and process)
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@@ Line 104: / Line 104: @@
 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black"|
-*C
+°C
 |-
 |style="background:LightGrey; color:black"|pH
 |style="background:WhiteSmoke; color:black"|
-,5 - 4,0 (3,5 - 3,8 recommended by manufacturer)
+,75 (3,5 - 3,8 recommended by manufacturer)
 |-