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Specific Process Knowledge/Doping: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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*[[Specific Process Knowledge/Thermal Process/Dope with Boron|Dope with Boron]] - Doping Silicon wafers with boron by thermal predeposition and drive-in
*[[Specific Process Knowledge/Thermal Process/Dope with Boron|Dope with Boron]] - Doping Silicon wafers with boron by thermal predeposition and drive-in
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon/Boron doped poly-Si and a-Si |Furnace LPCVD PolySilicon]] - Deposition of PolySi doped with boron or phosphorous
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon/Boron doped poly-Si and a-Si |Furnace LPCVD PolySilicon]] - Deposition of PolySi doped with boron or phosphorous
*[[Specific Process Knowledge/Thin film deposition/PECVD|PECVD]] - Making boron glass (BSG), phosphorous glass (PSG), boron-phosphorous glass PBSG or germanium doped glass
*[[Specific Process Knowledge/Thin film deposition/PECVD/Doping]] - Making boron glass (BSG), phosphorous glass (PSG), boron-phosphorous glass PBSG or germanium doped glass
*Ion implantation
*Ion implantation


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