Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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0.1 - 300 mm/sec | 0.1 - 300 mm/sec | ||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"| | |style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Y-axis cutting range | ||
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162 µm | |||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"| | |style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Y-axis index step | ||
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0.0002 mm | |||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W | |style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W | ||
Revision as of 13:20, 27 February 2008
Disco Automatic dicing saw, model DAD321
The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.
The dicer at DANCHIP is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.
A rough overview of the performance Disco DAD321 Dicer
| Purpose | Equipment for dicing out samples. |
|
|---|---|---|
| Performance | X-axis cutting range |
192 mm |
| . | X-axis cut speed |
0.1 - 300 mm/sec |
| . | Y-axis cutting range |
162 µm |
| . | Y-axis index step |
0.0002 mm |
| . | Max. scan depth as a function of trench width W |
1.2(W[µm]-5µm) |
| Hardware settings | Tip radius |
|
| Substrates | Substrate size |
|
| . | Substrate material allowed |
|
Comparing dicing parameters for different materials
| Silicon | Pyrex or bonded Si/Pyrex | |
|---|---|---|
| Bladetype | HUB Blade ZH05 (27HEEF) | HUBless Blade B1A862 |
| Cutlinewidth | 60 µm | 150 µm |
| Recommended feed speed | Up to 5 mm/sec | Up to 2 mm/sec (0.5 mm/sec) |
| Recommended dice depth | Leave 200 µm uncut. It's possible to cut through the sample. | Leave 200 µm uncut. It's possible to cut through the sample. |
| Max. sample thickness | 1.5 mm | 2.0 mm |
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