Specific Process Knowledge/Back-end processing/Disco Saw

Disco Automatic dicing saw, model DAD321

Dicer positioned on 1. floor bldg 346 room 157

The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicer at DANCHIP is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.

A rough overview of the performance Disco DAD321 Dicer

Purpose	Equipment for dicing out samples.	Pure Silicon samples Silicon bonded to Silicon Silicon bonded to Pyrex/Borofloat Pyrex/Borofloat
Performance	X-axis cutting range	192 mm
.	.	50 Å to 262 µm
.	Resolution xy	down to 0.067 µm
.	Resolution z	1Å, 10Å or 20Å
.	Max. scan depth as a function of trench width W	1.2(W[µm]-5µm)
Hardware settings	Tip radius	5 µm 45o cone
Substrates	Substrate size	up to 6"
.	Substrate material allowed	In principle all materials

Comparing dicing parameters for different materials

	Silicon	Pyrex or bonded Si/Pyrex
Bladetype	HUB Blade ZH05 (27HEEF)	HUBless Blade B1A862
Cutlinewidth	60 µm	150 µm
Recommended feed speed	Up to 5 mm/sec	Up to 2 mm/sec (0.5 mm/sec)
Recommended dice depth	Leave 200 µm uncut. It's possible to cut through the sample.	Leave 200 µm uncut. It's possible to cut through the sample.
Max. sample thickness	1.5 mm	2.0 mm
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Si V-groove diced with ZH05 blade