Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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|-valign="top"
|-valign="top"
|'''Index accuracy'''
|'''Index accuracy'''
|not known
|
|not known
|
|- valign="top"
|- valign="top"
|'''Wavelength range'''
|''''''
|400-1000 nm
|
|300-950 nm
|
|-valign="top"
|-valign="top"
|'''What kind of thin films can be measured'''
|''''''
|Any film that is transparent to the light in the given wavelength range
|
ex:
|
*Silicon Oxide
*Silicon nitride
*PolySilicon
*Photoresists
*SU8
*Other polymers
*Very thin layers of metals (<20 nm)
*and many more
|Any film that is transparent to the light in the given wavelength range
ex:
*Silicon Oxide
*Silicon nitride
*Very thin layers of PolySilicon
*Photoresists
*SU8
*Other polymers
*Very thin layers of metals (<20 nm)
*and many more
|-  
|-  
|}
|}

Revision as of 13:05, 27 February 2008

Disco Automatic dicing saw, model DAD321

Dicer positioned on 1. floor bldg 346 room


The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.



A rough overview of the performance Disco DAD321 Dicer

Purpose Equipment for dicing out samples.
  • Pure Silicon samples
  • Silicon bonded to Silicon
  • Silicon bonded to Pyrex/Borofloat
  • Pyrex/Borofloat
Performance X-axis cutting range

192 mm

. .

50 Å to 262 µm

. Resolution xy

down to 0.067 µm

. Resolution z

1Å, 10Å or 20Å

. Max. scan depth as a function of trench width W

1.2(W[µm]-5µm)

Hardware settings Tip radius
  • 5 µm 45o cone
Substrates Substrate size
  • up to 6"
. Substrate material allowed
  • In principle all materials



Comparing dicing parameters for different materials

Silicon Pyrex or bonded Si/Pyrex
Bladetype HUB Blade ZH05 (27HEEF) HUBless Blade B1A862
Cutlinewidth 60 µm 150 µm
Recommended feed speed Up to 5 mm/sec Up to 2 mm/sec (0.5 mm/sec)
Recommended dice depth Leave 200 µm uncut. It's possible to cut through the sample. Leave 200 µm uncut. It's possible to cut through the sample.
Max. sample thickness 1.5 mm 2.0 mm
Index accuracy
'
'


test
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