Specific Process Knowledge/Characterization/Lifetime scanner MDPmap: Difference between revisions

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-!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Instrument specifics
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Instrument specifics
 |style="background:LightGrey; color:black"|Detector
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 *975 nm
 **Power 0.5 W to 4.0 W
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+*Spot diameter for all laser 0.5 µm
-|style="background:LightGrey; color:black"|Electron source
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-|-
-|style="background:LightGrey; color:black"|Operating pressures
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-|-
-|style="background:LightGrey; color:black"|Options
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 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Batch size
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-*1 100 mm wafer
+*Sample sizs between 5 mm x 5 mm up to 16" or 210 mm x 210 mm
-*1 150 mm wafer
+*Sample thickness 10 µm to 20 mm
-*1 200 mm wafer (not full view)
-*Smaller samples
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 | style="background:LightGrey; color:black"|Allowed materials