Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
| Line 86: | Line 86: | ||
|Leave 200 µm uncut. It's possible to cut through the sample. | |Leave 200 µm uncut. It's possible to cut through the sample. | ||
|-valign="top" | |-valign="top" | ||
|''' | |'''Max. sample thichness''' | ||
|not any limits | |not any limits | ||
|not any limits | |not any limits | ||