Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
| Line 83: | Line 83: | ||
|-valign="top" | |-valign="top" | ||
|'''Recommended dice depth''' | |'''Recommended dice depth''' | ||
|Leave 200 µm uncut. It's possible to cut through the sample | |Leave 200 µm uncut. It's possible to cut through the sample. | ||
| | |Leave 200 µm uncut. It's possible to cut through the sample. | ||
|-valign="top" | |-valign="top" | ||
|'''Index range''' | |'''Index range''' | ||