Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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# Study the logbook for the e-beam writer: sheet 1 gives you an overview of which condition files (currents and apertures) have been in use recently by which user on which type of resist. On sheet 2 in this logbook you can find a writing time estimation program. | # Study the logbook for the e-beam writer: sheet 1 gives you an overview of which condition files (currents and apertures) have been in use recently by which user on which type of resist. On sheet 2 in this logbook you can find a writing time estimation program. | ||
# Study the manual for the machine, it can be found [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual|here]] | # Study the manual for the machine, it can be found [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual|here]] | ||
''' Prepare a process flow''' | |||
#Describe your entire process in a process flow. The process flow should include all information such as type and thickness of resist, size and type of substrate, which processes are to be done before and after e-beam writing. Find process flow templates [[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_Flows | here]]. '''Attach your process flow to your request for training.''' | |||
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