Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
Appearance
| Line 83: | Line 83: | ||
|-valign="top" | |-valign="top" | ||
|'''Recommended dice depth''' | |'''Recommended dice depth''' | ||
| | |Leave 200 µm uncut. It's possible to cut through the sample | ||
|Very dependent of how good the model fits. | |Very dependent of how good the model fits. | ||
|-valign="top" | |-valign="top" | ||