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Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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|-valign="top"
|-valign="top"
|'''Cutlinewidth'''
|'''Cutlinewidth'''
|Thin films up to 250 µm, Especially good for thick thin films and for wafer mapping
|60 µm
|Good for very thin films down to a few Å
|150 µm
|-valign="top"
|-valign="top"
|'''Recommended feed speed'''
|'''Recommended feed speed'''
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