Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
| Line 78: | Line 78: | ||
|Good for very thin films down to a few Å | |Good for very thin films down to a few Å | ||
|-valign="top" | |-valign="top" | ||
|''' | |'''Recommended feed speed''' | ||
|<250 µm (for silicon oxides > ~75nm) | |<250 µm (for silicon oxides > ~75nm) | ||
|20 Å to ~2µm (for silicon oxide) | |20 Å to ~2µm (for silicon oxide) | ||