Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
| Line 74: | Line 74: | ||
|HUBless Blade B1A862 | |HUBless Blade B1A862 | ||
|-valign="top" | |-valign="top" | ||
|''' | |'''Width of cutline''' | ||
|Thin films up to 250 µm, Especially good for thick thin films and for wafer mapping | |Thin films up to 250 µm, Especially good for thick thin films and for wafer mapping | ||
|Good for very thin films down to a few Å | |Good for very thin films down to a few Å | ||