Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

@@ Line 189: / Line 189: @@
 |'''[[Specific_Process_Knowledge/Lithography/ARP617|Copolymer AR-P 617]]'''
 |Positive
-|AllResist
+|[http://www.allresist.com AllResist]
 |Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack. Please contact [mailto:Lithography@danchip.dtu.dk Lithography] for information.
 |[[media:AR_P617.pdf‎|AR_P617.pdf‎]]
@@ Line 233: / Line 233: @@
 |'''AR-N 7520'''
 |Negative
-|AllResist
+|[http://www.allresist.com AllResist]
 |Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [mailto:pxshi@danchip.dtu.dk Peixiong Shi] for information.
 |[[media:AR-N7500-7520.pdf‎|AR-N7500-7520.pdf‎]]
@@ Line 273: / Line 273: @@
 |-
-|-style="background:LightGrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 |'''PMMA'''
 |Positive
-|
+| [http://www.allresist.com AllResist]
 |We have various types of PMMA in the cleanroom, none are provided by DTU Danchip. Please contact [mailto:Lithography@danchip.dtu.dk Lithography] for information.
 |
@@ Line 288: / Line 288: @@
 |-
-|-style="background:WhiteSmoke; color:black"
+|-style="background:LightGrey; color:black"
 |'''ZEP7000'''
 |Positive