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Specific Process Knowledge/Lithography/UVLithography: Difference between revisions

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[[File:UVLPic2.png|160px|right]]
[[File:UVLPic2.png|160px|right]]


'''Before you plan your UV processing and request for training on any equipment in UV lithography, please go through the following steps.'''
'''Before you plan your UV processing and request for training on any equipment in UV lithography, please go through the following steps.''' Include the information in the training request.
 
If you are new to photolithography, you can visit <u>[https://en.wikipedia.org/wiki/Photolithography this]</u> wikipedia webpage about photolithography before you start.
If you are new to photolithography, you can visit <u>[https://en.wikipedia.org/wiki/Photolithography this]</u> wikipedia webpage about photolithography before you start.
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** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist.
** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist.


*'''Exposure''': Choose which mask aligner you wish to use; you can find a list of mask aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>. Consider the exposure dose.
*'''Exposure''': Choose which mask aligner you wish to use, and consider the exposure dose.
** You can find a list of mask aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>.
** You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|here]]</u>.


* '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found <u>[[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication|here]]</u>.
* '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found <u>[[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication|here]]</u>.


* '''Development''': Choose which equipment you wish to use to develop your photoresist from <u>[[Specific_Process_Knowledge/Lithography/Development|this]]</u> list. Remember the development process (chemistry) influences the exposure dose.
* '''Development''': Choose which equipment you wish to use to develop your photoresist from <u>[[Specific_Process_Knowledge/Lithography/Development|this list]]</u>. Remember the development chemistry influences the <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|exposure dose]]</u>.


* '''Specify whether you wish to strip or lift-off your resist''': <u>[[Specific_Process_Knowledge/Lithography/Strip|strip]]</u> and <u>[[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]]</u>.
* '''Specify whether you wish to strip or lift-off your resist''': <u>[[Specific_Process_Knowledge/Lithography/Strip|strip]]</u> and <u>[[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]]</u>.