Specific Process Knowledge/Characterization: Difference between revisions
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'''SEM's at Danchip''' | '''SEM's at Danchip''' | ||
*[[/SEM LEO|SEM LEO]] | |||
*[[/SEM Zeiss|SEM Zeiss]] | |||
*[[/SEM Zeiss Supra 60VP|SEM Zeiss Supra 60VP]] | |||
*[[/SEM Supra 3|SEM Supra 3]] | |||
*[[/SEM Jeol|SEM Jeol]] | |||
*[[/SEM: Scanning Electron Microscopy |SEM LEO]] | *[[/SEM: Scanning Electron Microscopy |SEM LEO]] | ||
*[[/SEM: Scanning Electron Microscopy |SEM JEOL]] | *[[/SEM: Scanning Electron Microscopy |SEM JEOL]] | ||
Revision as of 10:40, 27 October 2015
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Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
- Transmission Electron Microscopy
Choose equipment
AFM
Element analysis
Optical and stylus profilers
Optical microscopes
Optical characterization
SEM's at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S
SEM's at Danchip
- SEM LEO
- SEM Zeiss
- SEM Zeiss Supra 60VP
- SEM Supra 3
- SEM Jeol
- SEM LEO
- SEM JEOL
- SEM Zeiss
- SEM Zeiss Supra 60 VP
- SEM Supra 3
TEM's at CEN
Various