Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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[[File:UVLPic1.png|400px|right]] | [[File:UVLPic1.png|400px|right]] | ||
* '''Prepare a process flow''' which describes all steps in your UV lithography process. You can find docx-templates [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|in this table]]. | |||
* '''Substrate pretreatment''': In many processes it is recommended to [[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat or prime]] your wafer before spin-coating. In some [[Specific_Process_Knowledge/Lithography/Coaters|spin-coaters]], these pretreatment processes are included in the spin coating of resist. | |||
* '''Spin Coater''': Do you wish to use a manual spin coater or a robot spin coater? A manual spin coater is recommended for batches < 5 wafers. See a list of spin coaters [[Specific_Process_Knowledge/Lithography/Coaters|here]]. | |||
* '''Resist Type''': Choose the type of resist you wish to use: | * '''Resist Type''': Choose the type of resist you wish to use: | ||
** Positive tone resist: Resist exposed to UV light will be dissolved in the developer. The mask is an exact copy of the pattern which is to remain on the wafer. | ** Positive tone resist: Resist exposed to UV light will be dissolved in the developer. The mask is an exact copy of the pattern which is to remain on the wafer. | ||
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** For dry or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ** For dry or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ||
* '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication|here]]. | * '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication|here]]. | ||
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