Specific Process Knowledge/Wafer cleaning: Difference between revisions
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Revision as of 12:29, 12 October 2007
Clean with:
- RCA - Two step process to remove organics and metals
- 7-up - Fake piranha etch of wafers and masks - removes organics and alkali ions
- Piranha - Removes organics and alkali ions
- BHF - Removing native oxide, etching of predep glass etc.
- IMEC - Cleaning before fusion bonding
- Soap Sonic - Cleaning of "dirty" wafers when entering the cleanroom