Specific Process Knowledge/Thin film deposition/Deposition of Aluminium Nitride: Difference between revisions
No edit summary |
|||
Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium_Nitride click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium_Nitride click here]''' | ||
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page--> | <!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page--> |
Revision as of 12:04, 7 October 2015
Feedback to this page: click here
Deposition of Aluminium Nitride
Write a short description of the process and how to perform the process.
Only one method at the moment
Cryofox PVD co-sputter/evaporation | |
---|---|
Generel description |
|
Stoichiometry |
|
Film Thickness |
|
Deposition rate |
|
Step coverage |
|
Process Temperature |
|
Substrate size |
|
Allowed materials |
|