Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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160 x 160 mm | 160 x 160 mm | ||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"| | |style="background:silver; color:black"|.||style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
50 Å to 262 µm | 50 Å to 262 µm | ||
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|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*up to | *up to 6" | ||
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|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed | |style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed | ||