Specific Process Knowledge/Lithography/EBeamLithography/RaithElphyManual: Difference between revisions

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== Rough estimation of exposure time ==
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|Beam diameter versus Beam current: The machine have three operating objective apertures (no. 15 on above illustration of the column) in order to obtain different beam diameters in different current ranges. The available apertures are called 'aperture 5' (60 µm), 'aperture 6' (100 µm) and 'aperture 7' (200 µm).
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= Mounting of chips or wafers into cassette =
= Mounting of chips or wafers into cassette =

Revision as of 13:04, 28 September 2015

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Purpose, location and technical specifications

Location

Techical Specification

The system can be characterized as follows:

  • The spot beam for electron beam writing is generated by a ZrO/W emitter and a four-stage electron beam focusing lens system, see illustration below.


Mounting of chips or wafers into cassette