Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions
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* Click 'DRIFT' and 'Edit parameters'. | * Click 'DRIFT' and 'Edit parameters'. | ||
* Select ‘Acquisition of bottom BE mark’, and click ‘Save’ and ‘Execute’. Exit the window by clicking ‘Cancel’. | * Select ‘Acquisition of bottom BE mark’, and click ‘Save’ and ‘Execute’. Exit the window by clicking ‘Cancel’. | ||
* If you are calibrating the high current of a double-current exposure you should increase the scan width to 40 microns and note the position of the drift mark. When calibrating the low current of a double-current exposure, make sure DRIFT scans the same drift mark as the high-current condition file. | * If you are calibrating the high current of a double-current exposure you should increase the scan width to 40 microns and note the position of the drift mark. When calibrating the low current of a double-current exposure, make sure DRIFT scans the same drift mark as the high-current condition file. Check [[Specific_Process_Knowledge/Lithography/EBeamLithography/FilePreparation#Double_current_exposure|here]] what to write in your sdf file for double current exposures. | ||
* Read the subsection on DRIFT subprogram if you wish to use a global mark as DRIFT mark (recommended in certain cases) | * Read the subsection on DRIFT subprogram if you wish to use a global mark as DRIFT mark (recommended in certain cases) | ||