Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

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It consist of two solutions: RCA1 and RCA2
It consist of two solutions: RCA1 and RCA2


The RCA1 contains H2O, NH4OH and H2O2 (5:1:1). It is used for removed of light organics, partiticles and metal.
The RCA1 contains H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removed of light organics, particles and metal.


The RCA2 cantains H20, HCl and H2O2 (5:1:1). It is used for removel of heavy metals, alkalis and metal hydroxides.
The RCA2 contains H<math>_2</math>0, HCl and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of heavy metals, alkalies and metal hydroxides.

Revision as of 13:12, 25 February 2008

The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet). It consist of two solutions: RCA1 and RCA2

The RCA1 contains HO, NHOH and HO (5:1:1). It is used for removed of light organics, particles and metal.

The RCA2 contains H0, HCl and HO (5:1:1). It is used for removal of heavy metals, alkalies and metal hydroxides.