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Specific Process Knowledge/Lithography/EBeamLithography/BEAMER: Difference between revisions

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'''If your pattern is larger than one field size''', it will be stitched by several fields. In the tab 'Multipass', you can choose to smooth the stitching errors by overlapping the fields to be stitched or by multipass method.
'''If your pattern is larger than one field size''', it will be stitched by several fields. In the tab 'Multipass', you can choose to smooth the stitching errors by overlapping the fields to be stitched or by multipass method.


There are 3 types of overlap methods; for all 3 methods you define an overlap width:
There are 3 types of '''overlap''' methods; for all 3 methods you define an overlap width:


'''a)''' standard: the overlap will be exposed with half dose both of field 1 and field2; <br>
'''a)''' standard: the overlap will be exposed with half dose both of field 1 and field2; <br>
interleaving: the overlap will be finger-jointed by field 1 and field 2;
'''b)''' interleaving: the overlap will be finger-jointed by field 1 and field 2; <br>
interleaving with extra field: the overlap will be finger-jointed by field 1, field 2 and an extra field 3, as illustrated below in figure c.
'''c)''' interleaving with extra field: the overlap will be finger-jointed by field 1, field 2 and an extra field 3, as illustrated to the right. <br>


The multipass method smooths the pattern writing over many fields, each field writing the pattern with e.g. half the dose in different areas of the main deflector; this is however not recommended for field sizes larger than 500 mm x 500 mm, as the distorion of the main deflector using larger field sizes may be larger than the stitching errors of two fields.
The '''multipass''' method smooths the field stitching errors by writing the pattern with half dose in different areas of the main deflector; by this method, pattern located in the corner of a writing field will be written partly by the corner of a writing field and partly by the central part of the writing field.