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Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions

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==Oxidation==
==Oxidation==
At Danchip we have seven furnaces for oxidation of silicon samples: Boron Drive-in + Pre-dep furnace (A1), Phosphorous Drive-in furnace (A3), Noble furnace, Anneal-oxide furnace (C1), Anneal-Bond furnace (C3), APOX furnace (D1) and Multipurpose Annealing furnace.
At Danchip we have sevem furnaces for oxidation of silicon samples: Boron Drive-in + Pre-dep furnace (A1), Gate Oxide furnace (A2). Phosphorous Drive-in furnace (A3), Anneal-oxide furnace (C1), Anneal-Bond furnace (C3), APOX furnace (D1) and Multipurpose Annealing furnace.


Oxidation can take place either by a dry process or a wet process, depending on what furnace that is used for the oxidation. The film quality for a dry oxide is better than the film quality for a wet oxide with regards to density and dielectric constant. However, the oxidation rate is slow for a dry oxide.
Oxidation can take place either by a dry process or a wet process, depending on what furnace that is used for the oxidation. The film quality for a dry oxide is better than the film quality for a wet oxide with regards to density and dielectric constant. However, the oxidation rate is slow for a dry oxide.