Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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Before you plan your UV processing and request for training on any equipment in UV lithography, go through the following steps: | Before you plan your UV processing and request for training on any equipment in UV lithography, go through the following steps: | ||
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# '''Resist Type''': Choose the type of resist you wish to use: | # '''Resist Type''': Choose the type of resist you wish to use: | ||
#* Positive tone resist: Resist exposed to UV light will be dissolved in the developer. The mask is an exact copy of the pattern which is to remain on the wafer. | #* Positive tone resist: Resist exposed to UV light will be dissolved in the developer. The mask is an exact copy of the pattern which is to remain on the wafer. | ||
#* Negative tone resist: Resist exposed to UV light will become polymerized and difficult to dissolve. The mask is an inverse copy of the pattern which is to remain on the wafer. | #* Negative tone resist: Resist exposed to UV light will become polymerized and difficult to dissolve. The mask is an inverse copy of the pattern which is to remain on the wafer. | ||
::A list of UV lithography resist types available at DTU Danchip can be found [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|here]]. | ::A list of UV lithography resist types available at DTU Danchip can be found [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|here]]. | ||
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# '''Thickness of resist''': In general, it is recommended to work with an aspect ratio of ~1, i.e. where the width of the pattern is of same size than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need: | # '''Thickness of resist''': In general, it is recommended to work with an aspect ratio of ~1, i.e. where the width of the pattern is of same size than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need: | ||
#* For [[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]] processes, we recommend resist thicknnesses ~5 times larger than the thickness of the metal to be lifted. | #* For [[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]] processes, we recommend resist thicknnesses ~5 times larger than the thickness of the metal to be lifted. | ||