Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions

== Rough estimation of exposure time ==

[[File:currentbeamsize.jpg|400px|right]]

= Mounting of chips or wafers into cassette =

Authorized users are allowed to unload a cassette from the robot loader (autoloader) and mount their substrate but '''not''' allowed to load the cassette into the loader after mount.

= Optical pre-alignment of wafers =

[[File:prealign1.jpg|600px|right]]

7. In the jdf-file, the theoretical (L-edit/CleWin) position of the P and Q marks should be defined. In the sdf-file the mark-detection should be set to semi-automatic 'S' (see section 7 in this manual and the separate sdf- and jdf-file preparation manual).

= Load and unload of cassettes into/from autoloader =

[[File:IMG_0186.jpg|600px|right]]

= Transfer of cassettes between autoloader and e-beam writer =

You can load the cassette into the e-beam writer from the loader control program (Ldr) from EBX Menu. This operation requires the autoloader to be in REMOTE.

= Calibration of condition file =

[[File:ebxmenu.jpg|400px]]

== Calibration procedure ==

=== Load and restore a condition file ===

*Load and restore a condition file, click ‘Select condition file...’, choose the file from the list, e.g. ‘0.2nA_ap7’ and click OK. Restore the file by clicking ‘RESTOR/Edit Parameter...’. From the RESTOR window, click ‘Excecute’; the machine will now restore the conditions of the colum, this will take a few minutes. Exit the RESTOR window by clicking ‘Cancel’.

=== Execute CURRNT, INITAE, and INITBE ===   

*Execute ‘CURRNT’ click ‘CURRNT/Execute’. The program ends by stating the average value of five measurements of the e-beam current; write this average current in the logbook.

=== Execute 'daily' ===

*Execute the pre-defined set of sub-programs called ‘daily’: click 'Commands/Batch...'. Click ‘Condition file...’, choose ‘daily’, and click OK and execute. This set of programs takes around 8-10 minutes to run.

== Detailed descriptions of subprograms ==

=== SFOCUS ===

=== PDEFBE ===

By using the (bottom) BE mark (specified in INITBE), the machine measures the gain and rotation of the main deflector ('''P'''rimary '''DEF'''lector using '''BE''' mark).

=== DISTMEM and DISTBE ===

DISTMEM and DISTBE measures the distortion of the beam over the entire writing field, i.e. positional errors in the beam over the entire writing field.

=== SUBDEFBE ===

=== DRIFT ===

You can choose any mark as a DRIFT mark. In a standard exposure, a (bottom plane) BE mark is used as DRIFT mark, but you can ask the machine to use one of your global marks as well, i.e. P or Q marks. This requires alignment in semi-automatic mode, however.

=== HEIMAP ===

= Exposure of mgn-files =

= Alignment of wafers or chips =

Alignment of wafer or chip requires specific training.

== AGCRG ==

{| cellpadding="2" style="border: 2px solid darkgray;" align="right"

== SETWFR ==

[[File:SETWFR.png|600px]]

== CHIPAL ==

[[File:CHIPAL.png|500px]]

= Troubleshooting =

'''No EBX Menu is open in any of the desktops:''' Open a console (click on arrow above the text ‘CPU’ on bottom menu bar) and from location (DTU)/ type ‘ebxmenu’.

== Basic unix operations ==

<pre>

== Calibration problems ==

'''No current can be detected when executing CURRNT:''' Use another condition file or call one of the contact persons to get help.

== Alignment problems ==

'''SETWFR cannot detect my P and Q marks:''' Unload your wafer/chip, remove the resist from your wafer marks and repeat your exposure with manual alignment: