Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions

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 |[[file:DRIFT mark.png|450px]]
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-| || DRIFT measurements (by PATH DRF5M) during a 7 hour long exposure. The machine will positionally correct for the displacement it observes during exposure, i.e. the maximum pattern displacement is the drift between every measurement point (5 min).  || According to this table (provided by JEOL) a global mark (P) can be used as a DRIFT mark in automatic or semi-automatic alignment mode if CHIPAL 0, V1, V4 or S is used. A chip mark can be used as a DRIFT mark in any case where CHIPAL is defined to CHIPAL 1 or CHIPAL 4.
+|In the DRIFT subprogram window, you can either use the BE mark (click 'acqisition of Bottom BE mark') or ask the machine to do a fine scan on your own global mark (tick 'rough scan not available' and enter the stage position of your global mark) || DRIFT measurements (by PATH DRF5M) during a 7 hour long exposure. The machine will positionally correct for the displacement it observes during exposure, i.e. the maximum pattern displacement is the drift between every measurement point (5 min).  || According to this table (provided by JEOL) a global mark (P) can be used as a DRIFT mark in automatic or semi-automatic alignment mode if CHIPAL 0, V1, V4 or S is used. A chip mark can be used as a DRIFT mark in any case where CHIPAL is defined to CHIPAL 1 or CHIPAL 4.
 |}