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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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|style="background:WhiteSmoke; color:black"|<b>Value</b>
|style="background:WhiteSmoke; color:black"|<b>Value</b>
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Sample dimensions
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Sample dimensions
|style="background:LightGrey; color:black"|Diameter
|style="background:LightGrey; color:black"|Diameter
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|style="background:WhiteSmoke; color:black"|
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|style="background:LightGrey; color:black"|Seed metal
|style="background:LightGrey; color:black"|Seed metal
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]].
Most commonly 100 nm of NiV
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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