Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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@@ Line 46: / Line 46: @@
 |style="background:WhiteSmoke; color:black"|<b>Value</b>
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Sample dimensions
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Sample dimensions
 |style="background:LightGrey; color:black"|Diameter
 |style="background:WhiteSmoke; color:black"|
-or 150 mm 4" or 6")
+, 100 or 150 mm (2", 4" or 6")
 |-
+|style="background:LightGrey; color:black"|Allowed thickness
+|style="background:WhiteSmoke; color:black"|
+mm
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black"|
 *C
 |-
 |style="background:LightGrey; color:black"|pH
 |style="background:WhiteSmoke; color:black"|
-acidic
+.5-3.8
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Sample requirements
 |style="background:LightGrey; color:black"|Seed metal
 |style="background:WhiteSmoke; color:black"|
-nm of either NiV, Ti/Au or Cr/Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]].
+NiV.
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
-Ask Customer Support for details
+Ask Danchip for details
 |-
 | style="background:LightGrey; color:black"|Forbidden materials
 |style="background:WhiteSmoke; color:black"|
-Ask Customer Support for details
+Ask Danchip for details|}
-|}
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