Jump to content

Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

← Older editNewer edit →
VisualWikitext
Lynhen (talk | contribs)
DCH-Employees-701
52 edits
Lynhen (talk | contribs)
DCH-Employees-701
52 edits
Line 42: Line 42:


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Electrochemical deposition of nickel


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Electroplating-Ni"