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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b>
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!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Electrochemical deposition of nickel


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
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|style="background:LightGrey; color:black"|Diameter
|style="background:LightGrey; color:black"|Diameter
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
50, 100 or 150 mm (~ 2", 4" or 6")
100 or 150 mm 4" or 6")
 
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|style="background:LightGrey; color:black"|Sample thickness
|style="background:WhiteSmoke; color:black"|
Maximum 1,0 mm


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|style="background:LightGrey; color:black"|Temperature
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
52*C
30*C
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|style="background:LightGrey; color:black"|pH
|style="background:LightGrey; color:black"|pH
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
3,5 - 3,8
acidic
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Sample requirements
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Sample requirements
|style="background:LightGrey; color:black"|Seed metal
|style="background:LightGrey; color:black"|Seed metal
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]].
100 nm of either NiV, Ti/Au or Cr/Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]].
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Most materials allowed. See below.
Ask Customer Support for details
|-  
|-  
| style="background:LightGrey; color:black"|Forbidden materials
| style="background:LightGrey; color:black"|Forbidden materials
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