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Specific Process Knowledge/Lithography/EBeamLithographyManual: Difference between revisions

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== SETWFR ==
== SETWFR ==


[[File:SETWFR.png|400px]][[File:RoughScan.png|400px]][[File:RoughScanGain.png|400px]]


1. Before saving your condition file you should run the sub program 'SETWFR'.
Before saving your condition file you should run the sub program 'SETWFR'.


SETWFR will scan your P and Q marks and align the exposure to the position of these.
SETWFR will scan your P and Q marks and align the exposure to the position of these.
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From the calibration window, click 'SETWFR/Edit parameters'. Fill out the SETWFR parameters.
From the calibration window, click 'SETWFR/Edit parameters'. Fill out the SETWFR parameters.


    Choose measurement mode 'Semi Auto'
*Choose measurement mode 'Semi Auto'
    enter the material size and slot number (e.g 4A)
*enter the material size and slot number (e.g 4A)
    enter the material center offset (from the pre-alignment) and L-edit coordinates of P mark and Q mark.
*enter the material center offset (from the pre-alignment) and L-edit coordinates of P mark and Q mark.
    In P-mark rough/fine scan settings, adjust scan settings and enter the width of your marks. Also check the gain settings are ok.
*In P-mark rough/fine scan settings, adjust scan settings and enter the width of your marks. Also check the gain settings are ok.
    Repeat point 4 for Q-mark rough/fine
*Repeat point 4 for Q-mark rough/fine
    Click save and execute the program.
*Click save and execute the program.
 
SETWFR
 
 
1. Before saving your condition file you should run the sub program 'SETWFR'.
 
SETWFR will scan your P and Q marks and align the exposure to the position of these.
 
From the calibration window, click 'SETWFR/Edit parameters'. Fill out the SETWFR parameters.
 
 
 
    Choose measurement mode 'Semi Auto'
    enter the material size and slot number (e.g 4A)
    enter the material center offset (from the pre-alignment) and L-edit coordinates of P mark and Q mark.
    In P-mark rough/fine scan settings, adjust scan settings and enter the width of your marks. Also check the gain settings are ok.
    Repeat point 4 for Q-mark rough/fine
    Click save and execute the program.
 
 


Standard gain setting for gold wafer marks or etched marks (5-10 µm deep):
Standard gain setting for gold wafer marks or etched marks (5-10 µm deep):


 
<pre>
  BE Coarse gain
  BE Coarse gain 1
1
  BE Middle gain 14
  BE Middle gain
  WAVE offset   128
14
  BE Fine gain   128
  WAVE offset
  BE offset     2020
128
</pre>
  BE Fine gain
128
  BE offset
2020
 




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As a last alternative, you can chose to find the mark manually; this is however not recommended.
As a last alternative, you can chose to find the mark manually; this is however not recommended.


    SETWFR will ask you whether you wish to find the mark manually, click OK.
SETWFR will ask you whether you wish to find the mark manually, click OK.


    In 'sspvideo' click 'change/SEM'
*In 'sspvideo' click 'change/SEM'
    open 'adjust' and 'Setting' and start the SEM.
*open 'adjust' and 'Setting' and start the SEM.
    Center the mark ROUGHLY and turn off the SEM again as fast as possible.
*Center the mark ROUGHLY and turn off the SEM again as fast as possible.
    Click to continue the SETWFR scan at your present position
* Click to continue the SETWFR scan at your present position
    It might be necessary to repeat the procedure with the Q-mark.
*It might be necessary to repeat the procedure with the Q-mark.




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When the subprogram 'SETWFR' has found the P and Q marks
When the subprogram 'SETWFR' has found the P and Q marks


    When SETWFR executes successfully feedback the 'P mark offset' to the OFFSET in the sdf file and re-compile the mgn-file.
When SETWFR executes successfully feedback the 'P mark offset' to the OFFSET in the sdf file and re-compile the mgn-file.




If SETWFR cannot find your marks:
If SETWFR cannot find your marks:


    Unload the cassette, unmount your chip/wafer and remove the resist from your chip/wafer marks. Mount, pre-align and load your sample again and execute the exposure using manual alignment (see procedure in troubleshooting, section 8).
Unload the cassette, unmount your chip/wafer and remove the resist from your chip/wafer marks. Mount, pre-align and load your sample again and execute the exposure using manual alignment (see procedure in troubleshooting, section 8).


== CHIPAL ==
== CHIPAL ==