Specific Process Knowledge/Thin film deposition/PECVD: Difference between revisions
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*Silicon wafers, Quarts (fused silica) wafers | *Silicon wafers, Quarts (fused silica) wafers | ||
**with layers of silicon oxide or silicon (oxy)nitride | **with layers of silicon oxide or silicon (oxy)nitride | ||
**Other material (can be allowed if less than 3.9 cm2 is exposed to the plasma (<5% coverage of a 4" wafer), please ask! | **Other material (can be allowed if less than 3.9 cm2 is exposed to the plasma (<5% coverage of a 4" wafer), please ask! | ||
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