Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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! width="200" | | ! width="200" | | ||
|- border="0" | |- border="0" | ||
| [[File:IMG_0239.jpg|150px]] | |||
|[[File:IMG_6440.jpg|150px]] [[File:IMG_6441.jpg|150px]] | |[[File:IMG_6440.jpg|150px]] [[File:IMG_6441.jpg|150px]] | ||
| [[File:IMG_6433.jpg|150px]] [[File:IMG_6434.jpg|150px]] | | [[File:IMG_6433.jpg|150px]] [[File:IMG_6434.jpg|150px]] | ||
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|[[File:IMG_6438.jpg|150px]] [[File:IMG_6439.jpg|150px]] | |[[File:IMG_6438.jpg|150px]] [[File:IMG_6439.jpg|150px]] | ||
|- align="center" | |- align="center" | ||
| 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | | chip Al/Cu cassette || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | ||
|} | |} | ||