Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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| [[File:IMG_6440.jpg|150px]] [[File:IMG_6441.jpg|150px]] | | [[File:IMG_6440.jpg|150px]] [[File:IMG_6441.jpg|150px]] | ||
| [[File:IMG_6433.jpg|150px]] [[File:IMG_6434.jpg|150px]] | | [[File:IMG_6433.jpg|150px]] [[File:IMG_6434.jpg|150px]] | ||
| [[File:IMG_6436.jpg| | | [[File:IMG_6436.jpg|150px]] [[File:IMG_6437.jpg|150px]] | ||
| [[File: | | [[File:IMG_6438.jpg|150px]] [[File:IMG_6439.jpg|150px]] | ||
|- align="center" | |- align="center" | ||
| 2" Ti cassette; wafers are mounted flat-up || 2" Al cassette; wafers are mounted flat-down || 4" Ti cassette; wafers are mounted flat-down || 4" Al cassette; wafers are mounted flat-down | | 2" Ti cassette; wafers are mounted flat-up || 2" Al cassette; wafers are mounted flat-down || 4" Ti cassette; wafers are mounted flat-down || 4" Al cassette; wafers are mounted flat-down | ||