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Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions

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DCH-Employees-701
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Lynhen (talk | contribs)
DCH-Employees-701
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| almost any
| almost any
| Base Materials:  
| Base Materials:  
*Silicon wafers
*Silicon
Seed metals:
Seed metals:
*Ti(10nm) + Au (80nm) (Recommended)
*Ti(10nm) + Au (80nm) (Recommended)
*Cr(10nm) + Au (80nm) (Recommended)
*Cr(10nm) + Au (80nm) (Recommended)
*Ti(10nm) + Cu (80nm) (Does not work)
  |-style="background:WhiteSmoke; color:black"
  |-style="background:WhiteSmoke; color:black"
! Comment
! Comment
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