Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
| Line 95: | Line 95: | ||
* Metals | * Metals | ||
| almost any | | almost any | ||
| | | Base Materials: | ||
|-style="background:WhiteSmoke; color:black" | *Silicon wafers | ||
Seed metals: | |||
*Ti(10nm) + Au (80nm) (Recommended) | |||
*Cr(10nm) + Au (80nm) (Recommended) | |||
*Ti(10nm) + Cu (80nm) (Does not work) | |||
|-style="background:WhiteSmoke; color:black" | |||
! Comment | ! Comment | ||
| | | | ||