Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Cu|Electroplating-Cu]]) | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
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|Sputter deposition of Cu | |Sputter deposition of Cu | ||
|Sputter deposition of Cu | |Sputter deposition of Cu | ||
|Electroplating of Cu | |||
|- | |- | ||
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|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|None | |||
|- | |- | ||
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|10Å to 1µm* | |10Å to 1µm* | ||
|10Å to 1µm* | |10Å to 1µm* | ||
| thickness window undefined yet | |||
|- | |- | ||
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Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | ||
| ~1Å/s | | ~1Å/s | ||
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*smaller pieces | *smaller pieces | ||
*Up to 1x6" wafers | *Up to 1x6" wafers | ||
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*1x4" wafer | |||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
| almost any | |||
| almost any | | almost any | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
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